04 / X-RAY
X-ray inspection
Use X-ray imaging on BGA, QFN and other packages to inspect internal solder balls, dies and bond wires, confirming that the structure is intact and undamaged.
Our quality commitment
Every component passes through our four professional inspections to ensure that the parts you receive are genuine.
Contact & enquiriesInspection focus
- BGA, QFN & other packages
- Internal solder balls & dies
- Bond wires & structural integrity
LET’S CONNECT
Let’s find
the next step.
For component enquiries and excess inventory discussions.
Business contact email
For sourcing enquiries or excess inventory sales, use the buttons below to view and copy our contact email.
- INVENTORY RECOVERY
- sales@szshyx.com
- PRE-SALES ENQUIRIES
- purchasing@szshyx.com
- Whatsapp&Wechat
- +86 18813319324